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high speed bright copper electroplating solution

High speed bright copper electroplating solution

Catalog No.
C007B-439508
Manufacturer No.
H475915-100ml
Manufacturer Name
Aladdin Scientific
Quantity
1
Unit of Measure
EA

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High speed bright copper electroplating solution is an electrolytic acid copper process engineered for plating copper bumps, pads, patterns and redistribution layers as well as filling vials and trenches on wide varieties of substrates including

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High speed bright copper electroplating solution is an electrolytic acid copper process engineered for plating copper bumps, pads, patterns and redistribution layers as well as filling vials and trenches on wide varieties of substrates including semiconductors, glass, polymers et al. This copper electroplating solution is made up of cupric sulphate and sulphuric acid with small additions of hydrochloric acid and organic additives. The organic additives have a wide concentration process window eliminating the need for separate additive solutions and replenishment for about 120 Amp-hours of electroplating.

Specifications and Purity: semiconductor grade

Related Documents: https://aladdin-for-icloud-store.oss-cn-hangzhou.aliyuncs.com/aladdinsci/pdp/sds/1/H475915-SCI_723b99cab23a45c8eabf7b3ac5289740.pdf

UPC:
42141802
Condition:
New
HazmatClass:
No
WeightUOM:
LB
MPN:
H475915-100ml
Product Size:
100ml
Hazard Statement Codes:
H410:H319:H315:H302:H290
Precautionary Statement Codes:
P301+P312+P330:P305+P351+P338

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