ApplicationSputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. It is commonly used for thin-film deposition, etching and analytical techniques.
Specifications and Purity: ≥99.95% metals basis, sputtering target, diam. × thickness 3.00 in. × 0.125 in.
Molecular Formula: Cr
Molecular Weight: 52
EC Number: 231-157-5
PubChem CID: 23976
Isomeric SMILES: [Cr]
Related Documents: https://ald-pub-files.oss-cn-shanghai.aliyuncs.com/aladdinsci/pdp/sds/1/C434741-SCI_5e44b426697f4a775d5117d1a6c7f7d5.pdf
- UPC:
- 12141709
- Condition:
- New
- HazmatClass:
- No
- WeightUOM:
- LB
- MPN:
- C434741-1EA
- CAS:
- 7440-47-3
- Product Size:
- 1EA
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