Usually used as the adhesive bonding material in adhesive wafer-level bonding technique,and also used in fabrication of high density multilayer interconnect structures using gold metallization and polymer interlayer dielectric.Photosensitive benzocyclobutene has been widely used as dielectric material in multilayer packaging applications.
Specifications and Purity: ≥98%
MDL Number: MFCD01321219
Molecular Formula: C8H8
Molecular Weight: 104.15
PubChem CID: 69667
Isomeric SMILES: C1CC2=CC=CC=C21
Related Documents: https://aladdin-for-icloud-store.oss-cn-hangzhou.aliyuncs.com/aladdinsci/pdp/sds/1/B107638-SCI_24b6e88db1070df90bfaec160c93f05b.pdf
- UPC:
- 51101905
- Condition:
- New
- HazmatClass:
- Yes
- WeightUOM:
- LB
- MPN:
- B107638-5g
- CAS:
- 694-87-1
- Physical Hazards:
- Flammable Liquid
- Product Size:
- 5g
- Hazard Statement Codes:
- H332:H226
- Precautionary Statement Codes:
- P501:P403+P235:P370+P378:P304+P340:P303+P361+P353:P280:P273:P271:P261:P243:P242:P241:P240:P233:P210
akash.verma@cenmed.com
(732) 447-1115





