Proofstress indicators

10 ppm Hg, 25 ppm Cd, Se 100 ppm: As, Be, Co, Cr, Cu, Fe, Mn, Ni, Pb, Zn 250 ppm V, 500 ppm Al Matrix: 5% HNO3 Min: >= 99.5 Max: = Manufactured and Tested in an ISO 17025/Guide 34 Accredited Facility

Alum, 10% w/v 1 L

Formula: Cu(NO₃)₂ in HNO₃ 2-3% Formula Weight: N/A Synonym(s): Copper nitrate in nitric acid Suprapur&reg 2-3% Description: Composition:

The Ricca Chemical copper standard is used to measure and detect the presence of sugar in chemical samples. It is also used in the process of water purification and as an agricultural poison.

Copper Standard, 20 ppm Cu 500 mL

Copper Standard, 200 ppm Cu 500 mL

IPTG is combined with X-GAL to detect lac+ colonies or cells in a colorimetric assay. Distinguishes recombinants (white) from non- recombinants (blue) in cloning strategies using vectors such as Lambda-11, M13mp 18 and 19, pUC18 and 19, pUR222

For DNA/RNA fragments from 200-800bp. Provides sharp resolution and low background.

The RPI TSI (triple sugar iron) agar is suitable for use in research facilities and chemical laboratories to conduct wide range of experiments. It is available in sturdy bottle that endures heavy and rigorous usage.

The Exaxol copper standard features a metal-free formulation and comes in a 500 mL bottle. It is mainly designed to use in chemical laboratories and research facilities. Application: For Laboratory use only

A thin film of pure carbon deposited on one side of the grid. The thickness range is as follows: Standard: Approx. 5-6nm Ultra-Thin (UL): 3-4nm Thick (TH): 10nm Extra Thick (ET): 20-30nm NOTE: All of our film is laid on the shiny side of the grid.

A thin film of pure formvar resin coats a single hole grid. The thickness range is as follows: Standard: Approx. 10nm Ultra-Thin (UL): 5-6nm Thick (TH): 15-20nm Extra Thick (ET): 25-50nm NOTE: All of our film is laid on the shiny side of the grid.